NVIDIA in Confidential Talks with Samsung and SK Hynix to Commercialize ‘2nd HBM’
NVIDIA is reportedly in confidential discussions with major memory semiconductor companies, including Samsung Electronics and SK Hynix, to commercialize a new memory standard known as “SOCAMM,” which is being hailed as the “second high-bandwidth memory (HBM).” This development, confirmed by industry insiders on Feb. 16, marks a significant shift in the memory semiconductor landscape, with potential implications for both the B2B server market and the burgeoning on-device AI sector.
SOCAMM is a cutting-edge DRAM module designed to enhance the performance of personal AI supercomputers. It offers superior cost-performance compared to existing DRAM modules used in small PCs and laptops, thanks to its integration of LPDDR5X DRAM, which is renowned for its low power consumption and high power efficiency. The module’s design includes 694 I/O ports, surpassing the 644 ports of the current LPCAMM standard, which helps alleviate data bottleneck issues—a critical challenge in AI computing.
One of the standout features of SOCAMM is its detachable nature, allowing for easy replacement and upgrades, thereby facilitating continuous performance improvements. Its compact size, comparable to an adult’s middle finger, enables the installation of more DRAM modules within the same area, further enhancing its appeal for high-performance computing applications.
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NVIDIA in Confidential Talks with Samsung and SK Hynix to Commercialize ‘2nd HBM’, source
